- Designed for high pressure
- Equipment certified to meet
- PC based, embedded recording of profile.
- For use with DAP, DAF, CUF, NCP, NCF, Paste
- Process innovation recognized in
semiconductor, PCB, MEMS and Optoelectronics industry.
- Best devoid solution for fine pitch and
narrow gap flipchip and CUF application.
various built in features and/or
Range: Max 200°C / 400°C
- Pressure: 8kg/cm²
- Fast Heating
- Fast Cooling
- O2 ppm Detection and Control
- And more
info, please fill in the form below.